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Development of heat-responsive adhesive materials that are stable during use and quickly deteriorate during dismantling

Polymer Journal volume 56, pages 223–247 (2024)Cite this article

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Abstract

When developing functional adhesives, material design is generally based on incorporating additional function without sacrificing the original adhesive performance. In contrast, the development of dismantlable adhesive materials—adhesives with on-demand debonding function—requires a different approach from ordinary functional adhesive materials since the function of disassembly is opposite to that of adhesion. In this review article, the author first provides an overview of recent studies on heat-responsive and photoresponsive adhesive materials and the characteristics of other external stimuli used for dismantlable adhesive systems. Then, research on dismantlable adhesive materials using polyperoxides is introduced as an example of early material design. Research trends in the synthesis of degradable polymers by radical polymerization, which are closely related to future environmental issues, are briefly referenced. Next, the development processes of dual-stimuli responsive dismantlable adhesive materials are interpreted as a guideline for the material design to achieve stability during use and degradability during dismantling. Finally, recent studies on heat-responsive dismantlable adhesive systems, in which thermal stability during use is prioritized while responding quickly during disassembly by heating, are described.

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  1. Department of Applied Chemistry, Graduate School of Engineering, Osaka Metropolitan University, 1-1 Gakuen-cho, Naka-ku, Sakai, Osaka, 599-8531, Japan

    Akikazu Matsumoto

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  1. Akikazu Matsumoto
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Matsumoto, A. Development of heat-responsive adhesive materials that are stable during use and quickly deteriorate during dismantling. Polym J 56, 223–247 (2024). https://doi.org/10.1038/s41428-023-00849-7

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